Diaspora Peserta SCKD 2019

Dr. Wardhana Aji Sasangka

NegaraSingapore

Foto Diri
Biografi Singkat

Wardhana is Principal Research Scientist at Singapore-MIT Alliance for Research Technology. He is leading the research activities on the reliability of compound semiconductor based devices. He uses advanced microscopy techniques such as transmission electron microscopy (TEM), electron energy loss spectroscopy (EELS), and photon emission microscopy (PEM) to understand how devices fail and then propose ways to improve the reliability. He has served as Technical Chair of IPFA 2018 and 2019. Wardhana received his B.Eng (Materials) from Nanyang Technological University in 2007 and PhD in Advanced Materials for Micro-and Nano-systems under Singapore-MIT Alliance Program in 2012.

link laman Profesional

https://www.researchgate.net/profile/Wardhana_Sasangka

Riwayat Pendidikan
Jenjang Institusi Fakultas/Bidang Tahun (mulai – selesai)
PhD NTU/Singapore-MIT Alliance Advanced materials for micro- and nano-systems 2007-2012
B.Eng NTU Materials Science and Engineering 2003-2007
Riwayat Pekerjaan Formal
Institusi Posisi/Jabatan Tahun
Singapore-MIT Alliance for Research and Technology Principal Research Scientist 2018
Singapore-MIT Alliance for Research and Technology Research Scientist 2014
Singapore-MIT Alliance for Research and Technology Postdoctoral Associate 2012
Massachusetts Institute of Technology Visiting Researcher 2007, 2010
Institusi Saat ini

Singapore-MIT Alliance for Research and Technology

Bidang Ilmu

Materials Science, Semiconductor

Fokus Penelitian
  • Reliability of Compound Semiconductor
Publikasi
Judul Nama Jurnal Tahun
Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors Microelectronics Reliability 2019
Influence of substrate nitridation on the threading dislocation density of GaN grown on 200 mm Si (111) substrate Thin Solid Films 2018
Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors Microelectronics Reliability 2018
High-performance AlGaInP light-emitting diodes integrated on silicon through a superior quality germanium-on-insulator Photonics Research 2018
Kinetics of thin film intermetallic compound formation in the Cu/SnxIn100-x system characterized using color change observations Journal of Alloys and Compounds 2018
Monolithic integration of Si-CMOS and III-V-on-Si through direct wafer bonding process IEEE Journal of the Electron Devices Society 2017
Anomalous Source-Side Degradation of InAlN/GaN HEMTs Under High-Power Electrical Stress IEEE Transactions on Electron Devices 2017
Characterisation of defects generated during constant current InGaN-on-silicon LED operation Microelectronics Reliability 2017
Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation Microelectronics Reliability 2017
Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing AIP Advances 2016
Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation Microelectronics Reliability 2016
Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films Journal of Materials Science 2016
Origin of physical degradation in AlGaN/GaN on Si high electron mobility transistors under reverse bias stressing IEEE IRPS Proceedings 2015
Influences of annealing on lithium-ion storage performance of thick germanium film anodes Nano Energy 2015
Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers Journal of Micromechanics and Microengineerig 2015
ZnS buffer layer for Cu2ZnSn (SSe) 4 monograin layer solar cell Solar Energy 2015
Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect Small 2013
Influence of bonding parameters on the interaction between Cu and noneutectic Sn-In solder thin films Journal Electronics Materials 2011
Mechanical property characterization of cu-Sn-In intermetallic thin films using microcantilevers IEEE IPFA Proceedings 2011
Effect of bonding and aging temperatures on bond strengths of Cu with 75Sn25In solders IEEE EPTC Proceedings 2009
High temperature performance study of gold wire bonding on a palladium bonding pad IEEE EPTC Proceedings 2006